首页 Texas Instruments(德州仪器) 比较器 TLV3501A-Q1
型号TLV3501A-Q1 |
品牌 |
分类比较器 |
描述具有关断功能的汽车级高速单路轨至轨比较器 |
|
产品概述参数 Number of channels | 1 | Output type | Push-Pull | Propagation delay time (µs) | 0.0045 | Vs (max) (V) | 5.5 | Vs (min) (V) | 2.7 | Vos (offset voltage at 25°C) (max) (mV) | 6.5 | Iq per channel (typ) (mA) | 3.2 | Input bias current (±) (max) (nA) | 0.01 | Rail-to-rail | In, Out | Rating | Automotive | Operating temperature range (°C) | -40 to 125 | Features | Hysteresis, Shutdown | VICR (max) (V) | 5.7 | VICR (min) (V) | -0.2 |
封装 | 引脚 | 尺寸 SOT-23 (DBV) | 6 | 8.12 mm² 2.9 x 2.8 |
特性 - Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature Range - Device HBM Classification Level 2
- Device CDM Classification Level C4B
- High Speed: 4.5 ns
- Rail-To-Rail I/O
- Supply Voltage: 2.7 V to 5.5 V
- Push-Pull CMOS Output Stage
- Shutdown
- Micro Package: SOT23-6
- Low Supply Current: 3.2 mA
- Z-Suffix Offers Improved Delamination
- APPLICATIONS
- HEV/EV and Powertrain Applications
- DC-DC Converter
- Inverter
- Fuel Sensing
- Hybrid Power Control Unit
- Automatic Test Equipment
- Threshold Detector
- Zero-Crossing Detector
- Window Comparator
All other trademarks are the property of their respective owners 说明 The TLV3501A-Q1 push-pull output comparator features a fast 4.5-ns propagation delay and operation from 2.7 V to 5.5 V. The input voltage supports a common-mode range that goes beyond the rails which makes the device an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. The fast delay and wide common-mode range also makes TLV3501A-Q1 device ideal for EMI reduction through frequency dithering by lowering the EMI peaks. These parameters allow the device to be ideal for both DC-DC converter and inverter applications in HEV/EV and powertrain. The SOT23-6 microsized package provides options for portable and space-restricted applications. The Z-suffix offers reduced delamination compared to the standard device. |