This family of GaN HEMT comes in a small form factor SMD package suitable for applications that require a compact device without a heatsink. The gallium nitride CoolGaN™ 600 V series is qualified according to a comprehensive GaN-tailored qualification well beyond existing standards. The PG-LSON-8 package is a leadless SMD package specially designed for Consumer SMPS and high-density chargersthat demand the highest efficiency and power density.

This low-profile package comes with a small footprint of 8x8mm². The package size with enhanced thermal resistance in combination with its benchmark low parasitics inductances can be used as a new and effective way to decrease system solution size in power-density-driven designs.

• Low power SMPS
• Charger/adapters
• Consumer SMPS based on the half-bridge topology (half-bridge topologies for hard and soft switching such as Totem pole PFC, high frequency LLC).