型号THS6022
品牌
分类功率运算放大器
描述250mA 双路差动 DSL 和 PLC 线路驱动器
产品概述

参数

Number of channels 2
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 9
Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 33
Iout (typ) (A) 0.25
GBW (typ) (MHz) 210
Slew rate (typ) (V/µs) 1900
Vos (offset voltage at 25°C) (max) (mV) 5
Offset drift (typ) (V/°C) 0.00002
Iq per channel (typ) (mA) 7.2
Rating Catalog
Operating temperature range (°C) -40 to 85, 0 to 70
Input bias current (max) (pA) 10000000
CMRR (typ) (dB) 73
Rail-to-rail No
Architecture DSL Line Driver, PLC Line Driver

封装 | 引脚 | 尺寸

HTSSOP (PWP) 14 32 mm² 5 x 6.4

特性

  • ADSL, HDSL and VDSL Differential Line Driver
  • 200-mA Output Current Minimum Into 50- Load
  • High Speed
    • 210-MHz Bandwidth (-3-dB) at 50- Load
    • 1900-V/µs Slew Rate, G = 5
  • Low Distortion
    • -69-dB Third-Order Harmonic Distortion at f = 1 MHz, 50- Load, and VO(PP) = 20 V
  • Independent Power Supplies for Low Crosstalk
  • Wide Supply Range ±5 V to ±15 V
  • Thermal-Shutdown and Short-Circuit Protection
  • Evaluation Module Available

PowerPAD, MicroStar Junior are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

说明

The THS6022 contains two high-speed drivers capable of providing 200-mA output current (minimum) into a 50- load. These drivers can be configured differentially to drive a 50-V p-p output signal over low-impedance lines. The drivers are current feedback amplifiers, designed for the high slew rates necessary to support low total harmonic distortion (THD) in xDSL applications. The THS6022 is ideally suited for asymmetrical digital subscriber line (ADSL) at the remote terminal, high-data-rate digital subscriber line (HDSL), and very high-data-rate digital subscribe line (VDSL), where it supports the high-peak voltage and current requirements of these applications. Separate power supply connections for each driver are provided to minimize crosstalk.

The THS6022 is packaged in the patented PowerPAD™ package. This package provides outstanding thermal characteristics in a small-footprint package that is fully compatible with automated surface-mount assembly procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the junction.